New Silicon Etcher Oxford Estrelas now operational

This new Si etcher is partially a replacement for the Adixen SE that will be decommissioned.
The etcher is capable of deep etching in Silicon with the Bosch process as well as for cryogenic processing and mixed-gas etching at room temperature. Beside that also etching of nanostructures is possible with this etcher.

Standard available processes:

·         High aspect ratio: up to aspect ratio 40. Etch rate 1 – 4 um/min.

·         Fine scallop etching; e.g pillars

·         High rate: for large structures. Etch rate up to 20 um/min

·         Cryo etching (up till 100um).

Because the Adixen SE will be decommissioned the running processes on that tool must be transferred to the new Estrelas and the SPTS etcher.

Contact Meint de Boer or René Wolf for advice in processing and transfer or introduction on the new etcher. During the poster sessions on de MESA+ Meeting on 25th September you can also get more information about this system

  

High rate etching                                                   High Aspect ratio etching

 

  

  Fine scallop etching of pillars